Product Description
Immersion gold multilayer PCBs have a special ENIG finish that provides superior soldering performance, corrosion resistance, and a flat surface perfect for mounting fine-pitch components. The nickel barrier layer prevents copper diffusion while gold ensures oxidation protection and wire bonding compatibility. Exceptional for high-frequency applications, RF circuits, and dense component layouts. Our controlled immersion process delivers uniform thickness and outstanding shelf life for demanding electronic applications.
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| Layer Counts | 3-18 layers |
| Base Material | Rogers |
| Bord Thickness | 0.8-3.2 mm |
| Maximum PCB Size | 570*850mm |
| PCB Size Tolerance | ±0.2-0.3mm |
| Min.Hole Size | 0.1mm |
| Min.Line Width | 4mil |
| Copper Weight2 | 2oz |
| Minimum Gold Plating Thickness | 0.25-1.3um |
| Minimum Nickel Plating Thickness | 3-5um |
| Certificate | UL , IPC-6012, RoHS, ISO 9001, ISO14001 |
immersion gold multilayer pcb
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