16 layer hdi step pcb

Price: $60.65

Product Description

Sequential lamination with stepped via technology enables our 16 layer HDI Step PCBs to achieve maximum routing density. Designed for advanced, high-speed electronic systems, they ensure excellent signal performance, reduced crosstalk, and smooth layer transitions. Ideal for applications such as 5G, AI, medical imaging, telecom, and advanced computing. Fully certified to ISO 9001 and IPC Class 3 standards, ensuring reliability in mission-critical systems.

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Layer Counts16 layers
Base MaterialHigh-Tg FR4, Rogers, Polyimide
Bord Thickness0.8-2.0mm
Maximum PCB Size570*670mm
Minimum PCB Size10*10mm
PCB Size Tolerance±0.2-0.3mm
Min.Hole Size0.1mm
Min.Line Width4mil
Copper Weight4oz
Surface FinishENIG, HASL, OSP are available
CertificateUL , IPC-6012, RoHS, ISO 9001, ISO14001
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Frequently Asked Questions

Usually, we use high-Tg FR4, polyimide, and low-loss materials like Rogers to fabricate16 layer hdi step PCBs.
Yes! Usually, we combine a cost-effective FR4 with a Rogers material with low Dk/Df to achieve a balance between signal quality and the costs.
We meet signal integrity on HDI by applying controlled impedance routing, proper stack-up design, minimizing crosstalk, and using low-loss materials.
Yes. Our engineers assist with the full design process, including impedance control, layer stack-up consultation, and DFM analysis to ensure optimal performance and manufacturability.
Acceptable payment methods are PayPal, T/T (bank transfer) or any major credit card. For big orders or making repeat orders, we can offer you more flexible payment options.
There are several shipping choices available such as DHL, FedEx, UPS, and air or sea freight. You can choose the logistics option that meets your budget and delivery deadline.