Product Description
Sequential lamination with stepped via technology enables our 16 layer HDI Step PCBs to achieve maximum routing density. Designed for advanced, high-speed electronic systems, they ensure excellent signal performance, reduced crosstalk, and smooth layer transitions. Ideal for applications such as 5G, AI, medical imaging, telecom, and advanced computing. Fully certified to ISO 9001 and IPC Class 3 standards, ensuring reliability in mission-critical systems.
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Layer Counts | 16 layers |
Base Material | High-Tg FR4, Rogers, Polyimide |
Bord Thickness | 0.8-2.0mm |
Maximum PCB Size | 570*670mm |
Minimum PCB Size | 10*10mm |
PCB Size Tolerance | ±0.2-0.3mm |
Min.Hole Size | 0.1mm |
Min.Line Width | 4mil |
Copper Weight | 4oz |
Surface Finish | ENIG, HASL, OSP are available |
Certificate | UL , IPC-6012, RoHS, ISO 9001, ISO14001 |
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