multilayer rf microwave pcb with ro4003c

Name: multilayer rf microwave pcb
Price: 104.49 USD
Availability: InStock

Price: $104.49

Product Description

Engineered with Rogers RO4003C substrate, our multilayer RF microwave PCB with RO4003C delivers exceptional performance for complex RF applications. This hydrocarbon ceramic material provides excellent electrical properties, low moisture absorption, and superior dimensional stability. Perfect for applications requiring multiple signal layers, integrated power distribution, and sophisticated grounding schemes while maintaining outstanding RF characteristics throughout the frequency spectrum.

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Specifications
Customer Reviews

Layer Counts	1-18 layers
Base Material	Rogers RO4003C
Bord Thickness	0.8-2.0mm
Dielectric Constant (Dk)	3.38 ± 0.05 @ 10 GHz
Loss Tangent (Df)	0.0027 @ 10 GHz
PCB Size Tolerance	±0.2-0.3mm
Thermal Conductivity	0.71 W/m·K
Min.Line Width	4mil
Copper Weight2	3oz
Surface Finish	ENIG, HASL, OSP are optional
Certificate	UL , IPC-6012, RoHS, ISO 9001, ISO14001

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Frequently Asked Questions

1. Why choose RO4003C for multilayer RF microwave PCB construction?

RO4003C has low loss and excellent dimensional consistency with stable Dk values, which are exactly what you need for in multilayer RF applications.

2. What's the maximum layer count you can achieve with RO4003C?

With advanced lamination, we can manufacture up to 18-layer RO4003C PCBs with a good signal integrity of the boards while maintaining uniform dielectric and electrical performance.

3. How do you handle thermal management in multilayer rf microwave pcb?

To improve dissipation in boards, we employ thermal vias, copper pours and heat-spreading techniques. We take advantage of the thermal conductivity of RO4003C to enable reliable high-power operation.

4. What's your capability for blind and buried vias in multilayer rf microwave pcb with ro4003c?

We support through, blind and buried vias as small as 0.1mm, installed by sequential lamination so that structural and electrical integrity is achieved in multilayer RO4003C PCBs.

5. How long does it take to manufacture multilayer RO4003C PCBs?

Standard lead time is 15–25 working days. For urgent projects, we offer expedited builds with turnaround times as fast as 8–12 working days.

6. Do you provide design guidelines for multilayer RO4003C layouts?

Yes, we provide stackup, impedance, via and thermal design guidelines specific to RO4003C. And our engineers will offer assistance during the whole design process.